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Kunshan plasma semiconductor packaging applications-Guoxing technology gives you better
Author:Original Click :1233 Date: 2021-04-16

Kunshan plasma semiconductor packaging applications: the bonding between the chip and the packaging substrate is often two materials of different properties. The surface of the material is usually hydrophobic and inert, and its surface bonding performance is poor, and the interface is easy during the bonding process The generation of voids brings great hidden dangers to the sealed and packaged chips. Plasma treatment on the surface of the chip and the package substrate can effectively increase the surface activity and greatly improve the fluidity of the bonding epoxy resin on the surface. Improve the bonding wettability of the chip and the package substrate, reduce the delamination between the chip and the substrate, improve the thermal conductivity, improve the reliability and stability of the IC package, and increase the life of the product.

昆山plasma半导体封装领域的应用-国兴技术给您更好的

Kunshan plasma semiconductor packaging applications: The quality of integrated circuit wire bonding has a decisive impact on the reliability of microelectronic devices. The bonding area must be free of contaminants and have good bonding characteristics. The presence of contaminants, such as oxides and organic residues, will severely weaken the pull value of the wire bond. The traditional wet cleaning does not completely remove or cannot remove the contaminants in the bonding area, while the use of plasma cleaning can effectively remove the surface contamination of the bonding area and activate the surface, which can significantly improve the bonding tension of the wire. Greatly improve the reliability of packaged devices.

昆山plasma半导体封装领域的应用-国兴技术给您更好的

Kunshan plasma semiconductor packaging applications: In flip chip packaging, plasma treatment of chips and packaging substrates can not only obtain ultra-clean soldering surfaces, but also greatly improve the activity of soldering surfaces, which can effectively prevent virtual Welding reduces voids and improves the reliability of welding. At the same time, it can increase the edge height and tolerance of the filler, improve the mechanical strength of the package, reduce the internal shear force formed between the interface due to the thermal expansion coefficient of different materials, and improve product reliability Sex and longevity.

昆山plasma半导体封装领域的应用-国兴技术给您更好的

Kunshan plasma semiconductor packaging applications: the microelectronic packaging field uses lead frame plastic packaging, which still accounts for more than 80%. It mainly uses copper alloy materials with good thermal conductivity, electrical conductivity, and processing performance as the lead frame, and copper oxide And some other organic pollutants will cause the delamination of the sealing mold and the copper lead frame, resulting in poor sealing performance and chronic air leakage after packaging. At the same time, it will also affect the bonding and wire bonding quality of the chip to ensure the lead frame Ultra-cleanliness is the key to ensuring the reliability and yield of the package. Plasma treatment can achieve the effect of ultra-purification and activation of the lead frame surface. The yield of the finished product will be greatly improved compared with the traditional wet cleaning, and it will avoid waste water discharge. Reduce the purchase cost of chemical potions.





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